Ansoft Releases TPA v4.2 with Seamless Integration to Synopsys' Encore; IC Package Designers Accurately Characterize Designs with Full Parasitic Extraction
PITTSBURGH—(BUSINESS WIRE)—July 13, 2005—
Ansoft Corporation (NASDAQ:ANST) announces Turbo Package
Analyzer(TM) (TPA) v4.2. This latest version combines new
bidirectional integration with Synopsys' Encore(TM) package-design
software with Ansoft's state-of-the-art 3D electromagnetic simulation.
It enables full parasitic extraction of complex IC packages, such as
ball-grid arrays (BGAs).
"As a result of our close collaboration, Ansoft's advanced
electromagnetic technology for package extraction and characterization
can be accessed directly from our Encore product today," said Kevin
Rinebold, Synopsys' senior technical marketing manager, Packaging
Products. "Our work with Ansoft further advances the state of the art
in package planning and design by integrating Ansoft's latest
capabilities with our IC/Package co-design environment."
With AnsoftLinks(TM), a tool for simplifying data import and
export between EDA and CAD packages, TPA v4.2 will generate
resistance, inductance and capacitance (RLC) models directly from
popular package design tools. It accepts CAD data and fully
characterizes the entire package in three dimensions. The 3D analysis
provided by the TPA v4.2 extraction engine can solve any BGA package
structure, including wirebonds, pads, vias, tapered traces, solder
balls and non-ideal power and ground structures.
For crosstalk simulations, TPA v4.2 automatically provides a
multi-conductor coupled RLC model for each lead in the package. The
user specifies the number of nearby (adjacent) leads for coupling, and
the program automatically calculates all of the parasitics.
TPA highlights include:
-- RLC extraction via 3D field solvers
-- Ansoft's state-of-the-art 3D field-solver technology
-- Fast Multipole Method for lumped parasitics
-- Full package extraction via automatic partitioning
-- Automatic partitioning via coupling length
-- Power and ground plane inclusion
-- Robust and automatic meshing
-- Critical net analysis
-- Seamless integration of TPA within Synopsys Encore
-- Including bondwires and solder balls
-- File export in Synopsys SNPS and SPEF formats
-- Outputs RLC, SPICE, IBIS .pkg
-- Package layout support through AnsoftLinks(TM) for Cadence and
Zuken
Pricing and Availability:
TPA v4.2 is available for Windows(R) and SUN/Solaris. Contact your
nearest Ansoft sales office for pricing information.
To download a high-resolution image, please go to
ftp://ftp.ansoft.com/techsup/download/web/primg/tpa42.tif.
About Ansoft
Ansoft is a leading developer of high-performance electronic
design automation (EDA) software. Engineers use Ansoft software to
design state-of-the-art electronic products, such as cellular phones,
Internet-access devices, broadband networking components and systems,
integrated circuits (ICs), printed circuit boards (PCBs), automotive
electronic systems and power electronics. Ansoft markets its products
worldwide through its own direct sales force and has comprehensive
customer-support and training offices throughout North America, Asia
and Europe. To learn more, please visit www.ansoft.com.
Contact:
Ansoft Corporation
John Arnold, 412-261-3200
FAX: 412-471-9427
EMAIL: Email Contact
